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    XC-0H Micro Series  Line Camera
    分辨率可达67，200dpi(375纳米)，非常适合晶圆表面高精度瑕疵检测！
    Advanced and Unique Pixel Size up to 375nm,
    A Suitable Solution for Wafer Surface High Precision Defect Inspection.

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商品描述

XC-0H Micro Series  Line Camera
分辨率可达67，200dpi(375纳米)，非常适合晶圆表面高精度瑕疵检测！
Advanced and Unique Pixel Size up to 375nm,
A Suitable Solution for Wafer Surface High Precision Defect Inspection.

Camera No.

Scan Width
(mm)

Resolution
(SDK switchable)
(dpi)

Miniature
Times(x)

Pixel Size
(SDK switchable)
nm/mm

Total
Pixels(Max)

Working Distance
(mm)

Focal Depth
(mm)

Highest

Others

Highest

Others

Dimension(mm)

Line Rate(kHz)

Scan Speed
(mm/Sec.)

XC-0H*00040

4.0

67,200 to 8,400

7

375nm to 3.0um

10,680

52.4

±0.06

3.57

7.14

1.34

*2*2*2

199.1

135

205

XC-0H*00063

6.3

38,400 to 4,800

4

660nm to 5.28um

9,600

52.4

2.36

XC-0H*00140

14.0

19,200 to 2,400

2

1.32um to 10.5um

10,680

70.2

4.72

XC-0H*00280

28.0

9,600 to 1,400

1

2.64um to 21.0um

10,680

70.2

9.45